Items filtered by date: March 2018

October 25, 2018
Stuttgart, Germany

Find out how you can benefit from the fast-curing, high-quality and low-VOC food packaging printing offered by UV/EB and UV-LED in a convenient one-day seminar on the 25th of October at Mövenpick airport hotel, Stuttgart.

Confirmed organizations to speak include Nestlé, OPM, Bobst, EuPIA, BASF, Allnex and many more!

This event is your chance to learn about all aspects of UV/EB and UV-LED for food packaging:

  • The latest technological developments
  • The current and expected regulatory requirements
  • The vision of customers and brand-owners
  • Real-life examples of the application of the technology for food packaging products

Registration is now open at https://www.radtech-europe.com/events/rte-food-packaging-seminar-2018

Published in Calendar of Events

Douglas Copen, Senior Packaging Safety Specialist with Nestle has just been added to the Conference Program at RadTech 2018, May 7-9, in Chicago www.radtech2018.com. Mr. Copen will be speaking on “Packaging Food Safety Concerns for Inks from a Brand Owner Perspective.” in a special EHS session taking place on Wednesday, May 9. Also in the session, Lynn Bergeson of Bergeson & Campbell will present on “What RadTech Members Need to Know about New TSCA,” reviewing what has happened, what EPA is poised to do next, and what provisions are expected to have the greatest impact on commercial operations. This session will be followed by a special meeting for attendees to discuss possible Association initiatives to address “New TSCA” concerns (please contact Gary Cohen at RadTech for information and if you would like to attend).

A new session has also just been added to the RadTech 2018 Conference Programming: New Technology Trends. Chaired by Sudhakar Madhusoodhanan and Ashwin Chockalingam of Applied Materials, the session will include: Use of High Refractive Index Materials in Display and Lighting Applications (including OLED Displays, HD Displays, OLED lighting, LED lighting); Radiation Cured Parts: Impact of Semiconductor Wafer Cleaning; Development of Functional Films and R2R Processes (for display screens and other applications); and Hydrophilicity Enhancement of UV Cured Acrylic Materials.

RadTech 2018 features over 100 presentations and 80 exhibitors. Discounted registration is available through April 20, for more information and to sign-up to join us, please visit www.radtech2018.com.

Published in Industry News

Contact: Mickey Fortune, 240-643-0517, mickey@radtech.org

Chevy Chase, MD (April 9, 2018) The winners of RadLaunch 2018, the new, unique idea tech accelerator for ultraviolet and electron beam (UV+EB) technology start-ups, students and innovators will present their innovations at RadTech 2018 in both the technical conference and on the exhibit floor in a dedicated RadLaunch Pavilion, sponsored by Heraeus Noblelight America.

The RadLaunch 2018 Class:

Trio Labs
Rapid UV 3D printing to create metal and ceramic parts with the same characteristics achieved through standard powder injection molding (PIM) processes.

Reboot Medical, Inc.
PhotoCast Casting Tape, light-cured composite tape that hardens on-demand, producing a rigid splint or cast.

Team from The Hebrew University of Jerusalem
Nanocrystal photocatalysts which fill an unmet need for efficient water-soluble photoinitiators for coatings and 2&3D printing.

moi composites
A new, patented process that merges the performances of thermosetting composite materials with the potentialities of Additive Manufacturing opening the world of advance composites to features today unimaginable.

The Foam Printing Project
Lightweight parts from resin that is foamed using a patent-pending process and solidified using a UV DLP 3D printer, parts have up to 75% gas fractions, are lighter weight and less expensive to produce.

Dynamic Matter LLC
UV curable thermosetting polymer that can be remolded, relax stress, or repurposed following polymerization for use in optical applications and composites to reduce shrinkage and environmental stresses.

Team from the University of Iowa
Transferrable Shadow Cure (TSC) decouples initiation and propagation mechanisms in cationic photopolymerization to address light penetration problems, thus providing full cure regardless of geometry, pigment and filler content, and sensitivity of material to light and heat.

RadTech 2018 takes place May 7-9, 2018 at the Hyatt Regency O’Hare in Rosemont, IL. For more information visit http://www.radtech2018.com.

Published in Industry News

RadTech Phone Number: (240) 497-1242

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