Wednesday, 18 April 2018 16:38

RadTech Europe Food Packaging Seminar

October 25, 2018
Stuttgart, Germany

Find out how you can benefit from the fast-curing, high-quality and low-VOC food packaging printing offered by UV/EB and UV-LED in a convenient one-day seminar on the 25th of October at Mövenpick airport hotel, Stuttgart.

Confirmed organizations to speak include Nestlé, OPM, Bobst, EuPIA, BASF, Allnex and many more!

This event is your chance to learn about all aspects of UV/EB and UV-LED for food packaging:

  • The latest technological developments
  • The current and expected regulatory requirements
  • The vision of customers and brand-owners
  • Real-life examples of the application of the technology for food packaging products

Registration is now open at

Additional Info

  • Date: October 25, 2018
  • Location: Stuttgart, Germany
Last modified on Tuesday, 26 June 2018 17:53

RadTech Phone Number: (240) 497-1242

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