Benefits:

• Increased Speed of Cure
• Ability to image at high resolution
• Low temperature cure for heat sensitive substrates
• Enhanced Bond Strength
• Ability to apply roll to roll, opening opportunities for flexible electronics
• Low viscosity allowing thin film application
• High solvent/chemical resistance of cured polymer to allow etching
• Allows flexibility in equipment design

Current & Potential End Uses:

• Flexible Electronics
• Automotive Electronics
• Disk Drives, Optical Storage
• Consumer Electronics Bonding
• Cell Phone Camera Assembly
• Digital Projector Assembly
• Displays, Masks
• Encapsulants
• Light Emitting Diodes (LED)
• Printed Circuited Boards (PCB)
• Surface Mount
• Computer Chips
• Semiconductor Manufacturing
• Printed Electronics
• Liquid Crystal Displays (LCD)
• Organic Light Emitting Diodes (OLED)